Category Archives: Electrical and electronics engineering drawings

BS EN 60191-6-3:2001, IEC 60191-6-3:2001 – Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of quad flat packs (QFP)

Available as PDF document for immediate download, or as printed publication – yes

Number of pages – 20 pages, A4

Manufacturer – BSI

Price – GBP 80

CLICK HERE FOR MORE INFORMATION

Keywords – Semiconductor devices, Electronic equipment and components, Standardization, Dimensions, Drawings, Engineering drawings, Surface mounting devices, Integrated circuits, Flat (shape), Packages
|

BS EN 60191-6-6:2001, IEC 60191-6-6:2001 – Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine pitch land grid array (FLGA). Proposed amendment on terminology

Available as PDF document for immediate download, or as printed publication – yes

Number of pages – 16 pages, A4

Manufacturer – BSI

Price – GBP 80

CLICK HERE FOR MORE INFORMATION

Keywords – Semiconductor devices, Electronic equipment and components, Standardization, Dimensions, Drawings, Engineering drawings, Surface mounting devices, Integrated circuits, Design, Graphic representation
|

BS EN 60139:2001, IEC 60139:2000 – Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges

Available as PDF document for immediate download, or as printed publication – yes

Number of pages – 34 pages, A4

Manufacturer – BSI

Price – GBP 130

CLICK HERE FOR MORE INFORMATION

Keywords – Technical drawing, Engineering drawings, Cathode-ray tubes, Electron-beam tubes, Electron tubes, Electron tube components, Electronic equipment and components, Gauges, Drawings, Dimensions
|

BS EN 60191-6-5:2001, IEC 60191-6-5:2001 – Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitchball grid array (FBGA)

Available as PDF document for immediate download, or as printed publication – yes

Number of pages – 14 pages, A4

Manufacturer – BSI

Price – GBP 64

CLICK HERE FOR MORE INFORMATION

Keywords – Semiconductor devices, Electronic equipment and components, Standardization, Dimensions, Drawings, Engineering drawings, Surface mounting devices, Integrated circuits, Design
|

BS EN 60191-6-1:2001, IEC 60191-6-1:2001 – Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for gull-wing lead terminals

Available as PDF document for immediate download, or as printed publication – yes

Number of pages – 12 pages, A4

Manufacturer – BSI

Price – GBP 64

CLICK HERE FOR MORE INFORMATION

Keywords – Semiconductor devices, Electronic equipment and components, Standardization, Dimensions, Drawings, Engineering drawings, Surface mounting devices, Integrated circuits, Design, Electric terminals
|

BS IEC 60191-2:1966 – Mechanical standardization of semiconductor devices. Dimensions

Available as PDF document for immediate download, or as printed publication – yes

Number of pages – 1036 pages, A4

Manufacturer – BSI

Price – GBP 360

CLICK HERE FOR MORE INFORMATION

Keywords – Semiconductor devices, Electronic equipment and components, Standardization, Dimensions, Shape, Drawings, Engineering drawings, Technical drawing, Interchangeability, Mechanical properties of materials
|

BS EN 60191-6-8:2001, IEC 60191-6-8:2001 – Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for glass sealed ceramic quad flatpack (G-QFP)

Available as PDF document for immediate download, or as printed publication – yes

Number of pages – 14 pages, A4

Manufacturer – BSI

Price – GBP 64

CLICK HERE FOR MORE INFORMATION

Keywords – Semiconductor devices, Electronic equipment and components, Standardization, Dimensions, Drawings, Engineering drawings, Surface mounting devices, Integrated circuits, Glass, Sealed, Ceramics, Interchangeability
|

BS EN 60191-3:2000, IEC 60191-3:1999 – Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of integrated circuits

Available as PDF document for immediate download, or as printed publication – yes

Number of pages – 62 pages, A4

Manufacturer – BSI

Price – GBP 160

CLICK HERE FOR MORE INFORMATION

Keywords – Semiconductor devices, Electronic equipment and components, Standardization, Dimensions, Integrated circuits, Technical drawing, Drawings, Engineering drawings, Dimensional tolerances
|

BS EN 60191-6-12:2002 – Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitch land grid array (FLGA). Rectangular type

Available as PDF document for immediate download, or as printed publication – yes

Number of pages – 24 pages, A4

Manufacturer – BSI

Price – GBP 114

CLICK HERE FOR MORE INFORMATION

Keywords – Semiconductor devices, Electronic equipment and components, Standardization, Dimensions, Drawings, Engineering drawings, Surface mounting devices, Integrated circuits, Design, Rectangular shape
|

BS EN 60848:2002 – GRAFCET specification language for sequential function charts

Available as PDF document for immediate download, or as printed publication – yes

Number of pages – 56 pages, A4

Manufacturer – BSI

Price – GBP 160

CLICK HERE FOR MORE INFORMATION

Keywords – Specification languages, Programming languages, Control systems, Automatic control systems, Function charts, Charts, Graphic representation, Graphic symbols, Symbols, Process control
|

BS EN 60191-6-2:2002, IEC 60191-6-2:2001 – Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Available as PDF document for immediate download, or as printed publication – yes

Number of pages – 14 pages, A4

Manufacturer – IEC

Price – GBP 64

CLICK HERE FOR MORE INFORMATION

Keywords – Semiconductor devices, Electronic equipment and components, Standardization, Dimensions, Drawings, Engineering drawings, Surface mounting devices, Integrated circuits, Design
|

BS EN 60191-6-13:2007 – Mechanical standardization of semiconductor devices. Design guideline of open-top-type sockets for fine-pitch ball grid array and fine-pitch land grid array (FBGA/FLGA)

Available as PDF document for immediate download, or as printed publication – yes

Number of pages – 18 pages, A4

Manufacturer – BSI

Price – GBP 80

CLICK HERE FOR MORE INFORMATION

Keywords – Semiconductor devices, Electronic equipment and components, Standardization, Dimensions, Engineering drawings, Technical drawing, Drawings, Symbols, Designations, Integrated circuits, Packages, Printed-circuit boards
|

BS 3934-10:1992 – Mechanical standardization of semiconductor devices. Schedule of UK national drawings giving dimensions

Available as PDF document for immediate download, or as printed publication – yes

Number of pages – 162 pages, A4

Manufacturer – BSI

Price – GBP 170

CLICK HERE FOR MORE INFORMATION

Keywords – Mechanical behaviour of materials, Mechanical properties of materials, Standardization, Electronic equipment and components, Semiconductor devices, Engineering drawings, Technical drawing, Drawings, Dimensions, Interchangeability, United Kingdom
|

05/30136813 DC – IEC 60191-2/F63 ED 1. Proposed new package outline, power package with 34 pins

Available as PDF document for immediate download, or as printed publication – yes

Number of pages – 7 pages, A4

Manufacturer – BSI

Price – GBP 20

CLICK HERE FOR MORE INFORMATION

Keywords – Semiconductor devices, Electronic equipment and components, Standardization, Dimensions, Shape, Drawings, Engineering drawings, Technical drawing, Electronic power supplies
|

05/30136816 DC – IEC 60191-2/F62 ED 1. Proposed new package outline, power package with 17 pins

Available as PDF document for immediate download, or as printed publication – yes

Number of pages – 7 pages, A4

Manufacturer – BSI

Price – GBP 20

CLICK HERE FOR MORE INFORMATION

Keywords – Semiconductor devices, Electronic equipment and components, Standardization, Dimensions, Shape, Drawings, Engineering drawings, Technical drawing, Electronic power supplies
|