Category Archives: Semiconductor devices

98/230486DC – IEC 60191-4. Mechanical standardization of semiconductor devices. Part 4. Coding system and classification into forms of package outlines for semiconductor device packages [IEC Document 47D/204/CDV]. Coding system and classification into forms of package outlines for semiconductor device packages

Available as PDF document for immediate download, or as printed publication – yes

Number of pages –

Manufacturer – IEC

Price – GBP 20

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Keywords – Semiconductor devices
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97/231121DC – IEC 60191-2. Proposal for a plastic shrink small outline package (SSOP), 1,00 mm lead length, outline family R-PDSO-G (47D/200/CDV). Dimensions. Plastic shrink small outline package (SSOP),1,00 mm lead length, outline family, R-PDSO-G

Available as PDF document for immediate download, or as printed publication – yes

Number of pages –

Manufacturer – IEC

Price – GBP 15

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Keywords – Semiconductor devices
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DC99/203697 – Draft British Standard BS IEC 60191-2-A28 Mechanical standardization of semiconductor devices. Dimensions. Plastic small outline package J-lead (P-SOJ), 10,16 mm body family

Available as PDF document for immediate download, or as printed publication – yes

Number of pages –

Manufacturer – IEC

Price – GBP 20

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Keywords – Semiconductor devices
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DC99/203699 – Draft British Standard BS IEC 60191-2-A20 Mechanical standardization of semiconductor devices. Dimensions. Plastic thin small outline package(P-TSOP II)10.16 mm body family

Available as PDF document for immediate download, or as printed publication – yes

Number of pages –

Manufacturer – IEC

Price – GBP 20

CLICK HERE FOR MORE INFORMATION

Keywords – Semiconductor devices
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